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The
Micro-Dicing Solution
The Microace series 3
provides a complete micro-dicing solution for the precision dicing, scribing and
grinding needs of the Electronic/Semi-conductor industry.
It is capable of processing a wide range of materials
including Silicon, Ferrite, Glass, Germanium, PZT and Sapphire up to 6
inch/152mm in diameter.
The MicroAce is fitted with our LDSD4 high powered
Air-bearing and Theta axis Air-bearing unit to ensure high accuracy and reliable
performance; and is one of the most easy to operate and maintain dicing machines
on the market.
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