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MPE, Inc. is dedicated to customer
service and customer satisfaction. We pride ourselves on the ability
to complete jobs in an exceptional and timely manner. We proudly offer
the following services: |
We provide dicing for a
wide range of hard materials including, but not limited to, Alumina
(ceramic), BGA singulation,Calcite, Ferrite, Fused Silica, Glass, Germanium,
PZT and Silicon. Material size up to 300mm/12".
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MPE, Inc. has
the capability of precision resizing of wafers with a tolerance of +/- 0.010" on
the OD dimension and a +/- 0.005" on the center position of the cored area.
We resize wafers to as small as 50mm from as large as 200mm. Please
click on the link above for more details.
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