Efficient Accuracy Is Our Objective

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MPE, Inc. is dedicated to customer service and customer satisfaction.  We pride ourselves on the ability to complete jobs in an exceptional and timely manner.  We proudly offer the following services:

Sub Contracting Dicing Service   We provide dicing for a wide range of hard materials including, but not limited to, Alumina (ceramic), BGA singulation,Calcite, Ferrite, Fused Silica, Glass, Germanium, PZT and Silicon. Material size up to 300mm/12".     Wafer Coring / Cut Down   MPE, Inc. has the capability of precision coring wafers with a tolerance of +/- 0.010" on the OD dimension and a +/- 0.005" on the center position of the cored area.  We core wafers to as small as 50mm from as large as 200mm.  Please click on the link above for more details.