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Sub-Contract Wafer Dicing Service

 

We provide dicing for a wide range of materials and wafers including, but not limited to:

▪ Alumina (ceramic)  Glass
BGA singulation  Germanium 
Calcite  PZT 
Ferrite Silicon
▪ Fused Silica Sapphire 

MPE has a staff with over 50 years experience in the dicing industry.  We take pride in being detail oriented, clean, exceptionally innovative, and timely.

We can dice your material free of charge to give you an example of the quality of work we provide.   We would be pleased to provide information about our services to you personally, so please feel free to contact us at  info@micrope.com or dial 1-877-MPE-DICE.

 

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1-877-MPE-DICE (673-3423)

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