Precision Wafer Resizing

MPE, Inc. has the capability of precision coring wafers with a tolerance of +/- 0.005" on the OD dimension and a +/- 0.005" on the center position of the cored area.  We can resize wafers to any diameter between 150mm to 50mm.  Our process is low stress and ESD friendly. 

Our capabilities allow us to center core or offset the core to allow our customers to maximize their yields by coring out precisely the die they need. 

Please contact us if this is something that you may be interested in and we can go over the details of this service.

Below is a picture of a 200mm wafer resized to 150mm and standard flat cut.

  Core was offset to maximize die yield.