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MPE, Inc. has the capability of precision
coring wafers with a tolerance of +/- 0.005" on the OD dimension and a +/-
0.005" on the center position of the cored area. We can resize wafers to
any diameter between 150mm to 50mm. Our process is low stress and ESD
friendly.
Our capabilities allow us to
center core or offset the core to allow our customers to maximize their yields by coring out precisely the
die they need.
Please contact us if this is something that you may be
interested in and we can go over the details of this service.
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