The MicroAce 66 is a 6” automatic dicing saw configured with a 2.4kW spindle as standard whilst other spindle set-ups are also available to suit a variety of applications including demanding and thick substrate cutting. The MicroAce 66 can be used for a wide range of applications, not just for dicing silicon wafers. It offers a high level of configurability to get the best performance out of your application.
Underpinning the MicroAce 66’s performance is the Loadpoint NanoControl control system. NanoControl uses a Loadpoint developed force-sensitive keypad with integrated tracker ball that provides a highly productive interface that is also robust for many years of service.