Our sub-contract dicing & coring divisions process a wide range of materials from various industries including semiconductors, MEMS, micro-optics, biochips, and other microelectronics.  We have capabilities to handle material up to 300mm / 12" in diameter.

Through the years of experience dicing virtually every type of material in the industry we have been able to develop a side dressed resin hubless dicing blade that allows more coolant to enter the cutting area.  This blade has less wear, produces significantly less chipping and allows for a higher feed/table rate.

The equipment sales division has both new and reconditioned dicing saws along with wash stations, wafer mounters and various other back-end semiconductor equipment.  Along with equipment the sales department also has parts for different dicing saws including a large inventory of air bearing spindles.