MPE, Inc. (Micro Precision Engineering) is an ITAR-registered corporation that was founded in 1993 to provide quick and efficient custom wafer dicing and wafer resizing services. Over the years, we have worked with hundreds of satisfied customers all over the world. We process wafers with a wide variety of integrated circuits and devices including analog, microprocessor, memory, ROIC, microwave, RF, MEMS, optoelectronic, sensors, and photonics. Our customers span industries including medical, military, academia, research, test and measurement, communications, computing, optics, and semiconductor manufacturing. This has allowed our team, which has a combined total of 40 years of experience, to work with virtually every type of material in the industry, including alumina, AlN, GaAs, GaP, GaN, fused silica, glass, quartz, germanium, SiC, Lexan, PZT, sapphire, SOI, and silicon wafers. We can accommodate all material sizes up to 300mm/12” in diameter and 10mm thick.
Custom Wafer Dicing and Wafer Resizing Services
Dicing Saws for Sale
Our facility, located just northeast of Dallas, Texas, is 8,000 square feet and includes multiple rooms equipped to safely and efficiently process material. Each room has several ESD measures in place, including wrist straps, ESD mats, ionized work stations, and ESD dicing film (for all ESD-sensitive material). Our state-of-the-art equipment, coupled with our outstanding process knowledge and experience, allow us to produce excellent cuts with minimal chipping. Our unique low-stress wafer resizing process results in downsized wafers with beveled and rounded edges without degradation to materials near the edge. We can work with any size semiconductor manufacturing firm. For smaller semiconductor firms without an in-house dicing facility, we can take care of all your wafer dicing and resizing needs. For medium to large semiconductor manufacturing firms that just cannot keep up with their orders, we can help by taking care of your overflow or assisting with R&D projects.