Advanced Dicing Projects

Companies often rely on MPE’s expertise for projects with unique dicing requirements that are beyond the capabilities of most basic dicing tools. For example, MPE can dice stacks of bonded wafers made from dissimilar materials (i.e. silicon on glass, GaN on SiC, etc.). We can produce beveled and chamfered edges, grooves of varied size and shape, and partial-depth cuts for scribe-and-break. In addition, many customers seek MPE for dicing exotic and uncommon materials. MPE can also handle non-standard substrate shapes, thicknesses, and sizes. MPE can accept drawings in almost any format and can help develop a dicing process for your company’s unique project.