Catalog

A manual press for tape/foil ring pairs from 94mm to 220mm diameter with closing and splitting capabilities.

The Washpoint is a self-contained, fully integrated free standing washing station for cleaning and drying wafers, substrate or plates up to 300mm in diameter following dicing, scribing or other machining processes.A flexible washing process allows all elements of the cleaning and drying sequence; cycletime, water pressure, gas pressure and dry heat output to be easily adjusted to meet…

The MicroAce series 3 provides a complete micro-dicing solution for the precision dicing, scribing and grinding needs of the Electronic/ Semiconductor industry. It is capable of processing a wide range of materials including Silicon, Ferrite, Glass, Germanium, PZT and Sapphire up to 6 inch/152 mm in diameter.

Loadpoint's NanoAce, a high precision machine tool suitable for the latest components produced by the Electronics/Semiconductor and related industries.

The NanoAce uses a high-powered air bearing spindle designed and manufactured by Loadpoint Bearings and has 4 motion axes - X, Y, Z and Theta.

Top of the Range Heidenhain TNC 426 Control System

Work holding with rotary…

The new MicroAce 66 150mm dicing saw is the latest release from Loadpoint and builds on the rugged reliable reputation of the MicroAce Series 3 for applications from prototypes to production volumes.

It maintains the strengths of the previous systems:

• Off-chuck contact height sensing - allowing use of conductive and non-conductive blades
• Rigid structure ensures high…

The MacroAce is a very large capacity dicing machine for heavy duty single and multiple blade applications. A work capacity of 250 x 250 x 30 mm combined with 120 mm of spindle vertical movement enables diced or slotted features to be machined on the top of thick assemblies.To provide all the features expected in a standard dicing machine Loadpoint have fitted their NanoControl system, used on…

Loadpoint's NanoAce is a high precision machine tool suitable for the latest components produced by the Electronics/Semiconductor and related industries.The NanoAce is dedicated to cutting, dicing and scribing operations on materials including Alumina, BGA moldings, Ceramic, Glass, GaAs, Sapphire, Germanium, Ferrite, PZT, and Silicon.The NanoAce uses a top of the range high powered air bearing…