Dicing saws - new

Loadpoint MicroAce 150mm Dicing Saw

Model:

MicroAce 66

Manufacturer:

Loadpoint Ltd


The MicroAce 66 is a 6” automatic dicing saw configured with a 2.4kW spindle as standard whilst other spindle set-ups are also available to suit a variety of applications including demanding and thick substrate cutting. The MicroAce 66 can be used for a wide range of applications, not just for dicing silicon wafers. It offers a high level of configurability to get the best performance out of…


Loadpoint NanoAce 200mm Dicing Saw

Model:

NanoAce 3200

Manufacturer:

Loadpoint Ltd


The NanoAce 3200 is an 8” dicing saw that also finds many applications in larger area substrate cutting and dicing. The NanoAce 3200 is an automatic dicing saw with vision alignment system and high resolution closed loop linear positioning encoders in all axes where high performance tolerances are required. Loadpoint offers a high level of configurability that allows the machine to be…


Loadpoint NanoAce 300mm Dicing Saw

Model:

NanoAce 3300

Manufacturer:

Loadpoint Ltd


The NanoAce 3300 is a 12” dicing saw that also finds many applications in larger area substrate cutting and dicing. The NanoAce 3300 is an automatic dicing saw with vision alignment system and high resolution closed loop linear positioning encoders in all axes where high performance tolerances are required. Loadpoint offers a high level of configurability that allows the machine to be…


Loadpoint MacroAce Dicing Saw

Model:

MacroAce II

Manufacturer:

Loadpoint Ltd


MacroAce II is intended for heavier duty applications requiring high power spindle delivery and large work areas.

The MacroAce II offers a unique combination of dicing machine performance with CNC-like power and work area capability. The spindle’s drive profile has been optimised to give maximum 4KW power delivery in the 1,000 – 10,000rpm range, exactly where it is required for heavier…