MPE provides dicing services for companies in need of singulation of integrated circuit (IC) chips from small scale or R&D wafer runs. Customers with small manufacturing runs often provide multi-project wafers (also known as “pizza masks” or “shuttle wafers”) with relatively complicated dicing requirements. MPE can dice multi-project wafers when the layout requires picking and remounting die in stages to avoid sawing through devices. Some customers require MPE to isolate and dice test modules out of larger circuits for quality or R&D testing.

Companies often rely on MPE’s expertise for projects with unique dicing requirements that are beyond the capabilities of most basic dicing tools. For example, MPE can dice stacks of bonded wafers made from dissimilar materials (i.e.

Many customers utilize MPE to produce custom-sized pieces from larger substrates or wafers available from various third-party material suppliers. For example, we can dice larger glass optical filters read more or read scenarios of Integrated Circuit Singulation and Advanced dicing projects.